How TSMC Keeps Getting Better
发布时间 2022-05-30 07:00:00 来源
摘要
In 2021, TSMC fabbed about 12 to 13 million 300-millimeter wafers. Assuming each die is about 100 square millimeters large, that is about 8 billion chips. Eight billion.
Semiconductor manufacturing is the most sophisticated, unforgiving high volume production technology that has ever been done successfully. You need a lot of practice. The more chips that TSMC makes, the better it gets at it.
In this video, I want to talk about how a fab like TSMC improves their operations. How they think about yield, speed up throughput, and in general get better at wafer fabrication.
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